Data Center Subfloor Encapsulation
Subfloor encapsulation incorporates the application of a Polyepoxide coating to the concrete subfloor plenum surface that
acts as a vapor and dust barrier. Concrete Sealing should be applied manually to the surface of the
subfloor plenum. Installing a Subfloor encapsulant is one of the best ways to reduce concrete dusting
and subsequent airborne particulate concentrations in your data center.
Benefits
Good bonding properties
Low VOC
Non flammable
No shrinking after curing
Seal the decorated concrete eliminating air borne dust particle
Help maintain dust free environment
Excellent chemical resistance
Solvent-free formula, virtually odorless
High build formula Suitable for concrete in interior applications
Resistant to oil, solvents and harsh cleaning chemicals